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NXG 2006
APM90 Spec Sheet

Disclaimer: All references are believed to be correct and accurate. Probe Specialists is not responsible for variances due to O.E.M. manufacturing tolerances, configuration, hardware, or software variances.

Accuracy within 5 Microns / 0.2 mil (± 2.5 microns)
Wafer Size 4,5, 6, and 8 inch
Maximum X/Y Speed 200 mm (8") / sec.
   
Z Stage/Chuck
Range 1.36"
Speed 35 ms/0.020" stroke
Rotation ± 5º
   
Loader (wafer handler)
Cassette Capacity 1 standard; 2nd cassette optional
Wafer handling robotic arm
Fine Alignment CCD image processing
Hard Disk Drive 100 Mb
Floppy Disk Drive 3.5"; 1 standard
Display 10.4" Color LCD
Power Consumption Approx 1.5 KVA
   
Facilities Required
Air 60 PSI @ 3 cfm.
Vacuum 25 in/hg.
Dimensions 44"w x 44" D x 35.2" H
Weight 1,650 lbs.

TSK Equipment | UF200 Spec Sheet | APM90 Spec Sheet

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