| WAFER SIZE CAPACITY |
| Authentic Wafer Sizing for 100mm, 125mm, 150mm, 200mm (4", 5", 6", 8") |
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| WAFER HANDLING |
| 1 cassette of 25 or 26 slots |
| Sequential |
| Programmable access controllable via external I/O |
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| Auxillary wafer tray |
| Quick single wafer insertion and extraction |
| Cross slot wafer detection |
| Quickloader station |
| Intelligent Quickload pipelining |
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| ACCURACY |
| ± 4µm (system accuracy includes X, Y, Ø and Z)** |
| **definition available upon request |
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| XY POSITIONING |
| Travel - 19.80" (503mm) X, 9.42" (239mm) Y |
| Maximum Speed - 10.0 in/sec (254.0 mm/sec) |
| Maximum Acceleration - 1.1G X axis, 0.53G Y axis |
| Resolution - 0.01 mils (0.25µm) |
| Repeatability - 0.01 mils (0.25µm) |
| CHUCK TOPS |
| Standard - ambient probing |
| Hot - ambient to 130ºC |
| Specials - other ranges (hot and cold) available |
| Available in Au, Ni, AI (unplated) |
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| AUTOMATION |
| PTPA* - Probe to Pad Alignment, Aluminized wafer, DPS II (Direct Probe Sensor II), APPV (Automatic Probe Position Verification) |
| PTPO* - Probe to Pad Optimization |
| OCR* - Optical Character Recognition |
| PMI* - Probe Mark Inspection |
| IDI* - Ink Dot Inspection |
| STAA - Self Teach Auto Align |
| WSSC - Wafer Stepping and Scaling Calibration |
| APCC* - Automatic Probe Cleaning and Continuity Pad |
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| SYSTEM ARCHITECTURE |
| Multiple processors based around a Pentium™ core |
| Flash memory (core program) |
| PCI bus internal PCBs (Serial and Video) |
| PCI bus Ethernet PCB providing 10 and 100 MHz I/O speeds * |
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| INTERFACE CAPABILITIES |
| Tester Interface Packages |
| All major ATE manufacturers |
| Motorized Probe Card Theta or Semi-Automatic Probe Card Changer are available on a variety of tester application packages |
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| GEM - Generic Equipment Model* |
| SEMI standard communications for factory automation and control |
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| AUI - Advanced User Interface |
| FPD - Flat Panel Display, 10.4" Active Matrix Display |
| Touch Screen - Standard Feature |
| Elastomer Keyboard* - Cleanroom compatible AT style |
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| NETWORKING AND TESTER COMMUNICATIONS |
| Standard Interfaces: RS232C, TTL (Parallel I/O), GPIB (IEEE-488) |
| Standard Protocols: EG Enhanced, RDP |
| Interface Protocols*: Ethernet (10/100 Mbps), GEM/HSMS compliant |
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| SOFTWARE |
EGCommander
A modular, object oriented software system designed for a balance of test environment flexibility and operational ease of use |
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| Design Feature Benefits: |
| User Configurable Operator Screens |
| Permits the user to set up simple operating screens for production use while maintaining the power and flexibility of EGCommander |
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| Recipe Structured |
| Probing process customization and optimization |
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| Graphic Control Map Editor |
| Designed probing modes to maximize productivity |
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| Checklists |
| Ensures repeatable probing process |
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| EG Prober Vision Compatible |
| Transfer most current Electroglas 2000/3000 test programs |
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| DIMENSIONS |
| Footprint - 45.3" (115 cm)W x 35.2" (89.4cm) D x 34.2" (88cm) H |
| Weight - 1027 lbs (462 kgs) |
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| FACILITY REQUIREMENTS |
