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4080 Spec Sheet
Disclaimer: All references are believed to be correct and accurate. Probe Specialists is not responsible for variances due to O.E.M. manufacturing tolerances, configuration, hardware, or software variances. All specifications are subject to change without notice.
| WAFER SIZE CAPACITY |
| Authentic Wafer Sizing for 100mm, 125mm, 150mm, 200mm (4", 5", 6", 8") |
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| WAFER HANDLING |
| 1 cassette of 25 or 26 slots |
| Sequential |
| Programmable access controllable via external I/O |
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| Correlation wafer tray (25 slot cassette) |
| Quick single wafer manual load/unload |
| Cross slot wafer sense/protection |
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| ACCURACY |
| Within 0.2mil (5µm). The placement of all die on all 10, 8" wafers in the Electroglas accuracy test are within 5µm of the desired location. The 0,0 reference point is taught on a center die of the first wafer. |
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| XY POSITIONING |
| Travel - 19.80" (503mm) X, 9.42" (239mm) Y |
| Speed Maximum - 13.0 in/sec (330.0 mm/sec) |
| Acceleration Maximum - 1.2G X axis, 1.0G Y axis (acceleration is variable) |
| Resolution - 0.04 mil (1µm) |
| Repeatability - 0.04 mil (1µm) |
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0.25 mil |
0.125mil |
| Rec. Load |
25lbs (11.3kgs) |
40lbs (18.0 kgs) |
| Resolution Z |
0.25 mil/step |
0.125 mil/step |
| Speed |
390 µsec/step |
390 µsec/step |
| Probing Range |
230 mil (5.8mm) |
230 mil (5.8mm) |
| Travel-Full |
400 mil (10.2mm) |
400 mil (10.2mm) |
| Repeatability Z |
0.25 mil (6.4µm) |
0.125 mil (3.2µm) |
| ø Travel |
±5º |
±5º |
| Deflection |
<1.5mil@25lbs
r=2.75", T=25ºC |
< 2.5mil@40lbs |
| o Resolution |
0.000917º/step |
0.000917º/step |
| CHUCK TOPS |
| Three Universal Chuck Options |
| Standard - ambient probing |
| Hot - ambient to 130ºC |
| 25ºC - ambient to 8ºC below ambient probing (cooling only; lower limit 17ºC subject to device power dissipiation) |
| Available in Au, Ni, AI (unplated) |
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| AUTOMATION |
| PTPA - Probe to Pad Alignment |
| PTPO - Probe to Pad Optimization |
| OCR - Optical Character Recognition |
| PMI - Probe Mark Inspection |
| IDI - Ink Dot Inspection |
| STAA - Self Teach Auto Align |
| APCC - Automatic Probe Cleaning and Continuity Pad |
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| ELECTRONIC HARDWARE |
| Multiple processor architecture with dedicated real time probing controller, 275MB hard drive, 3.5" microfloppy and VGA color monitor |
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| TESTER INTERFACE PACKAGES |
| All major ATE manufacturers |
| Motorized Probe Card Theta or Semi-Automatic Probe Card Changer are available on certain tester application packages. |
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| NETWORKING AND TESTER COMMUNICATIONS |
Standard Interfaces:
Hardware: RS232C, TTL (Parallel I/O), GPIB (IEEE-488) |
| Protocols: EG Enhanced (recommended), SECS I/II, RDP |
| Optional Interfaces: Ethernet/TCP/IP, Ethernet/DECNET |
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| SOFTWARE- EGCommander |
| EGCommander is a modular, object oriented software system. The inherent modularity and extendibility ensures a future growth path. |
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| Design Feature Benefits: |
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| Recipe Structured |
| Probing process customization and optimization |
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| Checklists |
| Ensures repeatable probing process |
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| Graphic Control Map Editor |
| Designed probing modes to maximize productivity |
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| EG Prober Vision Compatible |
| Transfer most current Electroglas 2000/3000 test programs |
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| DIMENSIONS |
| Footprint - 45.3" (115 cm)W x 38.9" (99cm) D x 34.2" (88cm) H |
| Weight - 1027 lbs (462 kgs) |
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| RELIABILITY |
| Better than 3000 MTBF |
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| FACILITY REQUIREMENTS |
| Electrical: |
VOLTS |
AMPS |
Hz |
|
100 |
16.5 |
50/60 |
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115 |
15 |
50/60 |
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230 |
7.5 |
50/60 |
| Air: |
minimum 85 psi CDA, 3.0 SCFM |
| Vacuum: |
22 in Hg minimum |
| DIAGNOSTICS |
| Prober diagnostics include self test. |
Wafer Probers | 2001 Spec Sheet | 2080 Spec Sheet | 4090 Spec Sheet | 4080 Spec Sheet
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